Renesas Emulation Pod for M30240 Group MCUs M30240T-RPD-E Informazioni Techniche Pagina 17

  • Scaricare
  • Aggiungi ai miei manuali
  • Stampa
Vedere la pagina 16
( 15 / 58 )
Chapter 2. Preparation
This chapter describes the package components, the system configuration and the preparation for using this product for the
first time.
2.1 Terminology ............................................................................................................................... 16
2.2 Package Components.................................................................................................................. 17
2.3 Other Tool Products Required for Development........................................................................ 17
2.4 Name of Each Part...................................................................................................................... 18
(1) System Configuration ........................................................................................................... 18
(2) Inside of Emulation Pod ....................................................................................................... 19
2.5 When Using the Emulator for the First Time ............................................................................. 20
Vedere la pagina 16
1 2 ... 12 13 14 15 16 17 18 19 20 21 22 ... 59 60

Commenti su questo manuale

Nessun commento